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Shenzhen June� Automation Co., Ltd.
 
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Shenzhen June� Automation Co., Ltd.
[China]
Address:
4/F, 1st Building, No 142, Zhu Guang Bei Lu, Nanshan Shenzhen Guangdong 518000 China
Phone:
86-755-86238792
Contact name:
Kevin Zhang , Sales Manager
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Shenzhen June� Automation Co., Ltd.



 
Products

New Etek

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New Etek

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UPH:14K
High Accuracy Performance: 2.5mil Bond Pad Size
X/Y Travel:4"*4"
θ Table: + -180
Z Travel:0.47inch/12mm
Z Resolution:+ -0.05mil
Bond Angle:30/90
Bond head clearance:4.8mm
Flexible Work Chuck for Various Products
Automatic Wire Loading System
Automatic Wire Loss Detection
Intelligent PR System (iPR)
LCD touch screen
Bilingual Menu
Power 800W
Dimension 760 x 1050x 1450mm
Weight 280 kgs

wire bonder, die bonder, wedge bonder


Related Keywords: Wire bonder


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