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Shenzhen June� Automation Co., Ltd.
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UPH:14K High Accuracy Performance: 2.5mil Bond Pad Size X/Y Travel:4"*4" θ Table: + -180 Z Travel:0.47inch/12mm Z Resolution:+ -0.05mil Bond Angle:30/90 Bond head clearance:4.8mm Flexible Work Chuck for Various Products Automatic Wire Loading System Automatic Wire Loss Detection Intelligent PR System (iPR) LCD touch screen Bilingual Menu Power 800W Dimension 760 x 1050x 1450mm Weight 280 kgs
wire bonder, die bonder, wedge bonder
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